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A service of Semiconductor Business News, CMP Media Inc.
Updated 10:30 a.m. EST; 7:30 a.m. PST, 12/1/97
1997 SIA roadmap targets new milestones
SAN JOSE -- The 1997 update to the National Technology Roadmap for Semiconductors provides much more detail about future requirements of logic ICs, distinguishing performance milestones based upon whether the chip is intended for high-volume applications, battery-powered systems or high-performance equipment. In addition, the roadmap shows DRAMs and microprocessors sharing the role of technology drivers for the next 14 years (see today's news story).
The roadmap, produced by the Semiconductor Industry Association here, treats microprocessors as both performance- and cost-sensitive devices, while ASICs represent low-volume, high-performance circuits.
"Clearly, the 1997 roadmap is the most extensive effort that the SIA has engaged in to date," said Jim Glaze, vice president of technology programs for the U.S. trade group. "What we learned from the 1994 roadmap process allowed us to dig into significantly more detail [in the different categories of ICs].
Below is a summary of a number of key milestones identified in the new SIA roadmap, which will become publicly available Dec. 8.
|
1997 |
1999 |
2001 |
2003 |
2006 |
2009 |
2012 |
| Technology generations |
|
|
|
|
|
|
|
| DRAM (half-pitch) |
0.25µ |
0.18µ |
0.15µ |
0.13µ |
0.10µ |
0.07µ |
0.05µ |
| MPU (gate length) |
0.20µ |
0.14µ |
0.12µ |
0.10µ |
0.07µ |
0.05µ |
0.035µ |
| DRAMs |
|
|
|
|
|
|
|
| Samples |
256-Mbit |
1-Gbit |
-- |
4-Gbit |
16-Gbit |
64-Gbit |
256-Gbit |
| Production ramp up |
64-Mbit |
256-Mbit |
1-Gbit |
1-Gbit |
4-Gbit |
16-Gbit |
64-Gbit |
| Logic transistors/cm² |
|
|
|
|
|
|
|
| MPUs |
3.7 million |
6.2 million |
10 million |
18 million |
39 million |
84 million |
180 million |
| ASICs |
8 million |
14 million |
16 million |
24 million |
40 million |
64 million |
100 million |
| Die size (mm²) |
|
|
|
|
|
|
|
| DRAMs |
280 |
400 |
445 |
560 |
790 |
1,120 |
1,580 |
| MPUs |
300 |
340 |
385 |
430 |
520 |
620 |
750 |
| ASICs |
480 |
800 |
850 |
900 |
1,000 |
1,100 |
1,300 |
| Frequency (MHz) |
|
|
|
|
|
|
|
| Transistor speed |
750 |
1,250 |
2,100 |
3,500 |
6,000 |
10,000 |
1,300 |
| Across-chip speed |
750 |
1,200 |
1,400 |
1,600 |
2,000 |
2,500 |
3,000 |
| Voltage (V) |
1.8-2.5 |
1.5-1.8 |
1.2-1.5 |
1.2-1.5 |
0.9-1.2 |
0.6-0.9 |
0.5-0.6 |
| Packaging (pins/balls) |
|
|
|
|
|
|
|
| MPU/MCUs |
600 |
810 |
900 |
1,100 |
1,500 |
2,000 |
2,700 |
| ASICs |
1,100 |
1,500 |
1,800 |
2,200 |
3,000 |
4,100 |
5,500 |
|
|
|
|
|
|
|
|
| Wafer size (mm) |
200 |
300 |
300 |
300 |
300 |
450 |
450 |
Source: SIA's 1997 National Technology Roadmap for Semiconductors
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